IEEE NSREC 2021
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  • 3D Plus (Booth 206)
  • Advantest (Booth 325)
  • Alphacore, Inc. (Booth 406)
  • Alpha Data (Booth 103)
  • Analog Devices (Booth 226)
  • Apogee Semiconductor (Booth 418)
  • BAE Systems (Booth 218)
  • The Boeing Company (Booth 321)
  • Cobham Semiconductor Solutions (Booths 119-121)
  • Crane Electronics, Inc (Booth 408)
  • Crocker Nuclear Lab (Booth 404)
  • Cypress / DPACI (Booth 107)
  • Data Device Corporation (Booth 319)
  • EMPC (Booth 220)
  • FASTRAD (Booth 123)
  • Foss Therapy Services (Booth 426)
  • Freebird Semiconductor Corporation (Booth 222)
  • Glenair, Inc. (Booth 210)
  • Honeywell (Booth 208)
  • Intersil Space Products (Booths 114-116)
  • IR HiRel/Infineon (Booth 118)
  • iXblue (Booth 224)
  • J.L. Shepherd & Assoc. (Booth 309)
  • Lawrence Berkeley National Laboratory (Booth 327)
  • Los Alamos National Laboratory (Booth 422)
  • Microchip (Booth 102)
  • Micropac Industries, Inc. (Booth 110)
  • Micross (Booth 402)
  • MIT Lincoln Laboratory( Booth 323)
  • NASA Electronic Parts and Packaging (Booth 212)
  • National Reconnaissance Office (Booth 112)
  • Northrop Grumman Corporation (Booth 122)
  • ON Semiconductor (Booth 313)
  • Phoenix, LLC (Booth 108)
  • PULSCAN, (Booth 120)
  • Radiation Test Solutions, Inc. (Booth 105)
  • Robust Chip (Booth 420)
  • Sandia National Laboratories (Booth 303)
  • Silvaco (Booth 109)
  • SkyWater Technology Foundry (Booth 412)
  • Southwest Research Institute (Booth 125-127)
  • STMicroelectronics, Inc. (Booth 410)
  • Texas A&M Cyclotron Institute (Booth 311)
  • Texas Instruments (Booths 202-204)
  • University of Washington - Medical Cyclotron Facility (Booth 307)
  • Vanderbilt University / ISDE (Booth 424)
  • VORAGO Technologies (Booth 104)
  • VPT, Inc. (Booth 111-113)
  • Xilinx (Booth 305)

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