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3D Plus (Booth 206)
Advantest (Booth 325)
Alphacore, Inc. (Booth 406)
Alpha Data (Booth 103)
Analog Devices (Booth 226)
Apogee Semiconductor (Booth 418)
BAE Systems (Booth 218)
The Boeing Company (Booth 321)
Cobham Semiconductor Solutions (Booths 119-121)
Crane Electronics, Inc (Booth 408)
Crocker Nuclear Lab (Booth 404)
Cypress
/
DPACI
(Booth 107)
Data Device Corporation (Booth 319)
EMPC (Booth 220)
FASTRAD (Booth 123)
Foss Therapy Services (Booth 426)
Freebird Semiconductor Corporation (Booth 222)
Glenair, Inc. (Booth 210)
Honeywell (Booth 208)
Intersil Space Products (Booths 114-116)
I
R HiRel/Infineon (Booth 118)
iXblue (Booth 224)
J.L. Shepherd & Assoc. (Booth 309)
Lawrence Berkeley National Laboratory (Booth 327)
Los Alamos National Laboratory (Booth 422)
Microchip (Booth 102)
Micropac Industries, Inc. (Booth 110)
Micross (Booth 402)
MIT Lincoln Laboratory( Booth 323)
NASA Electronic Parts and Packaging (Booth 212)
National Reconnaissance Office (Booth 112)
Northrop Grumman Corporation (Booth 122
)
ON Semiconductor (Booth 313)
Phoenix, LLC (Booth 108)
PULSCAN, (Booth 120)
Radiation Test Solutions, Inc. (Booth 105)
Robust Chip (Booth 420)
Sandia National Laboratories (Booth 303)
Silvaco (Booth 109)
SkyWater Technology Foundry (Booth 412)
Southwest Research Institute (Booth 125-127)
STMicroelectronics, Inc. (Booth 410)
Texas A&M Cyclotron Institute (Booth 311)
Texas Instruments (Booths 202-204)
University of Washington - Medical Cyclotron Facility (Booth 307)
Vanderbilt University / ISDE (Booth 424)
VORAGO Technologies (Booth 104)
VPT, Inc. (Booth 111-113)
Xilinx (Booth 305)
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Supported by: