PAPER SUMMARY DEADLINE
FEBRUARY 5, 2010

SUBMIT SUMMARY HERE

SPONSORED BY
IEEE/NPSS Radiation Effects
Committee

SUPPORTED BY
Defense Threat Reduction Agency
Air Force Research Laboratory
Sandia National Laboratories
Jet Propulsion Laboratory
NASA Electronic Parts and
  Packaging Program
BAE Systems
Intersil
Honeywell
Boeing
Northrop Grumman
Southwest Research Institute
Aeroflex Colorado Springs

CONFERENCE COMMITTEE

General Chairman
Joseph Benedetto
Radiation Assured Devices
jbenedetto@radiationassureddevices.com

Technical Program
Jeffrey Black
Vanderbilt/ISDE
jeffrey.d.black@vanderbilt.edu

Local Arrangements
Hugh Barnaby
Arizona State University
hbarnaby@asu.edu

Short Course
Ron Lacoe
The Aerospace Corporation
ronald.c.lacoe@aero.org

Publicity
Teresa Farris
Aeroflex Colorado Springs
Teresa.Farris@Aeroflex.com

Finance
Dennis Thompson
ITT Space Systems
dennis.thompson@itt.com

Awards
Lew Cohn
NRL
Lewis.Cohn@nrl.navy.mil

Industrial Exhibits
Kirby Kruckmeyer
National Semiconductor
Kirby.Kruckmeyer@nsc.com

Web Support
Martha O'Bryan
MEI Tech. Inc. at NASA/GSFC
martha.v.obryan@nasa.gov

At this meeting of engineers, scientists, and managers, papers will describe nuclear, space, atmospheric, and terrestrial radiation effects on electronic and photonic materials, devices, circuits, sensors, and systems. Papers will also describe semiconductor processing technology and design techniques for producing radiation-tolerant (hardened) devices and integrated circuits. International participation is strongly encouraged.  

We are soliciting papers describing significant new findings in the following or related areas:  

Basic Mechanisms of Radiation Effects in Electronic Materials and Devices 

• Ionizing Radiation Effects 
• Materials and Device Effects 
• Displacement Damage 
• Single-Event Charge Collection Phenomena and Mechanisms
• Radiation Transport, Energy Deposition and Dosimetry
• Processing-Induced Radiation Effects

• MOS, Bipolar, and Advanced Technologies 
• Isolation Technologies, such as SOI and SOS 
• Optoelectronic and Optical Devices and Systems 
• Methods for Hardened Design and Manufacturing 
• Modeling of Devices, Circuits and Systems 
• Particle Detectors and Associated Electronics for High-Energy Accelerators
• Cryogenic or High Temperature Effects 
• Single-Event Effects 
• Novel Device Structures, such as MEMs and Nanotechnologies

• Characterization and Modeling of Radiation Environments 
• Space Weather Events and Effects 
• Spacecraft Charging 
• Predicting and Verifying Soft Error Rates (SER)

• Testing Techniques, Guidelines and Hardness Assurance Methodology
• Unique Radiation Exposure Facilities or Novel Instrumentation Methods
• Dosimetry

New Developments of Interest the Radiation Effects Community 

PAPER SUMMARY DEADLINE:
FEBRUARY 5, 2010

PROCEDURE   
FOR SUBMITTING   
SUMMARIES   
 
 
 
 
 
 
 

PAPER SUMMARIES MUST BE RECEIVED BY FEBRUARY 5, 2010   SUBMIT PAPER SUMMARY HERE

 
  

Authors must conform to the following requirements: 

1.  Prepare a single Adobe Acrobat file consisting of an informative two to four page summary describing results appropriate for 12-minute oral or a poster presentation. The summary must include sufficient detail about the work to permit a meaningful technical review. In the summary, clearly indicate (a) the purpose of your work, (b) significant new results with supporting technical material, and (c) how your work advances the state of the art. Show key references to other related work. The summary must be no less than two and no more than four pages in length, including figures and tables. All figures and tables must be large enough to be clearly read. Note that this is more than an abstract, but do not exceed four pages.

2.  Prepare your summary in single-column format, using 11 point or greater font size, formatted for either U.S. Standard (8.5 x 11 inch) or A4 (21 x 29.7 cm) page layout, with 1 inch (2.5 cm) margins on all four sides.

3.  Obtain all corporate, sponsor, and government approvals and releases necessary for presenting your paper at an open attendance international meeting.

4.  Summary submission is electronic only, through www.nsrec.com. The submission process consists of entering the paper title, author(s) and affiliation(s), and an abstract no longer than 35 words. Authors are prompted to state their preference for presentation (oral, poster, or data workshop poster) and for session. Details of the submission process may be found at www.nsrec.com. The final category of all papers will be determined by the Technical Program Committee, which is responsible for selecting final papers from initial submissions.

Papers accepted for oral or poster presentation at the technical program will be eligible for publication in a special issue of the IEEE Transactions on Nuclear Science (December 2010) based upon papers from the Conference. Selection for this issue will be based on a separate submission of a complete paper. These papers will be subject to the standard full peer review given all papers submitted to the IEEE Transactions on Nuclear Science. Further information will be sent to prospective authors upon acceptance of their NSREC summary. It is not necessary to be an IEEE member to present a paper or attend the NSREC. However, we encourage IEEE and NPSS membership of all NSREC participants.

RADIATION EFFECTS    
DATA WORKSHOP    

The Radiation Effects Data Workshop is a forum for papers on radiation effects data on electronic devices and systems.  Workshop papers are intended to provide radiation response data to scientists and engineers who use electronic devices in a radiation environment, and for designers of radiation-hardened systems.   Papers describing new simulation or radiation facilities are also welcomed.  The procedure for submitting a summary to the Workshop is identical to the procedure for submitting NSREC summaries.  Radiation Effects Data Workshop papers will be published in a Workshop Record and are not candidates for publication in the Conference issue of the IEEE Transactions on Nuclear Science.